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● Soldering Materials ● HOZAN Desoldering Wick & GOOT High-Density Integrated Circuit Board Solder & Copper Wire ●
Product Details
● This listing is for materials used for soldering: HOZAN desoldering braid, goot high-density integrated circuit board solder, and copper wire.
● These are remaining portions from previous use.
● They are in clean condition.
● Details are as follows:
? HOZAN Desoldering Braid
?HOZAN-MICK HS-390-2.0
?Remaining amount: Approximately 125 cm
② goot High-Density Integrated Circuit Board Solder
?goot RMA type no-clean solder SD-60 for high-density integrated circuit boards
?Contains flux, for home use
?Remaining amount is unknown, but I believe there is more than 80% left.
③ Copper Wire
?Remaining amount is unknown. (I have not measured it as the wire deforms when straightened.)
● I am also listing various other items, so please take a look if you are interested.
● Thank you for your consideration.
Daily Cleaning: Use a soft brush or damp cloth to gently wipe away dirt. Avoid harsh chemicals. For mesh areas, use diluted mild detergent and a soft brush.
Drying: Air dry in a cool, shaded place after cleaning. Avoid direct sunlight or high heat, which can cause fading and glue deterioration.
Storage: Stuff with paper to maintain shape when not in use. Store in a dry, ventilated area to prevent mold. Rotate between multiple pairs to extend lifespan.
Usage Notes: Designed for basketball. Not recommended for hiking, long-distance running, or other specialized sports where different performance features are required.


